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MC33263 Ultra Low Noise 150 mA Low Dropout Voltage Regulator with ON/OFF Control
Housed in a SOT23-L package, the MC33263 delivers up to 150 mA where it exhibits a typical 180 mV dropout. With an incredible noise level of 25 mVRMS (over 100 Hz to 100 kHz, with a 10 nF bypass capacitor), the MC33263 represents the ideal choice for sensitive circuits, especially in portable applications where noise performance and space are premium. The MC33263 also excels in response time and reacts in less than 25 ms when receiving an OFF to ON signal (with no bypass capacitor). Thanks to a novel concept, the MC33263 accepts output capacitors without any restrictions regarding their Equivalent Series Resistance (ESR) thus offering an obvious versatility for immediate implementation. With a typical DC ripple rejection better than -90 dB (-70 dB @ 1 kHz), it naturally shields the downstream electronics against choppy power lines. Additionally, thermal shutdown and short-circuit protection provide the final product with a high degree of ruggedness. Features:
ULTRA LOW NOISE 150 mA LOW DROPOUT VOLTAGE REGULATOR WITH ON/OFF CONTROL
SILICON MONOLITHIC INTEGRATED CIRCUIT
6 1
* * * * * * * * * * * * *
Very Low Quiescent Current 170 A (ON, no load), 100 nA (OFF, no load) Very Low Dropout Voltage, typical value is 137 mV at an output current of 100 mA Very Low Noise with external bypass capacitor (10 nF), typically 25 Vrms over 100 Hz to 100 kHz Internal Thermal Shutdown Extremely Tight Line Regulation typically -90 dB Ripple Rejection -70 dB @ 1 kHz Line Transient Response: 1 mV for DVin = 3 V Multiple Output Voltages Available Logic Level ON/OFF Control (TTL-CMOS Compatible) ESR can vary from 0 to 3W Functionally and Pin Compatible with TK112xxA/B Series Extremely Tight Load Regulation, typically 20 mV at DIout = 150 mA
NW SUFFIX PLASTIC PACKAGE CASE 318J-01 (SOT-23L)
PIN CONNECTIONS
ON/OFF 1 GND 2 BYPASS 3 (Top View) 6 VIN 5 GND 4 VOUT
Applications: All Portable Systems, Battery Powered Systems, Cellular Telephones, Radio Control Systems, Toys and Low Voltage Systems MC33263 Block Diagram
ORDERING INFORMATION
6 Input Shutdown 1 ON/OFF Thermal Shutdown 4 Output Device MC33263NW-28R2 MC33263NW-30R2 MC33263NW-32R2 MC33263NW-33R2 MC33263NW-38R2 MC33263NW-40R2 MC33263NW-47R2 MC33263NW-50R2 Version 2.8 V 3.0 V 3.2 V 3.3 V 3.8 V 4.0 V 4.75 V 5.0 V Operating Ambient Temperature Range
3 Bypass
Band Gap Reference
TA = - 40 to +85C
2 GND
* Current Limit * Antisaturation * Protection
5
All Devices Available in SOT-23L 6 Lead Package GND
(c) Motorola, Inc. 1998
Rev 1
MOTOROLA DEVICE DATA
1
MC33263
MAXIMUM RATINGS
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Power Supply Voltage 6 Vin PD 12 V Power Dissipation and Thermal Resistance Maximum Power Dissipation NW Suffix, Plastic Package Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Operating Ambient Temperature Maximum Junction Temperature Storage Temperature Range RqJA RqJC Internally Limited 210 W C/W C/W C C C TA TJmax Tstg -40 to +85 150 -60 to +150
Rating
Pin #
Symbol
Value
Unit
DEVICE MARKING
XALYW
Marking A B
Version 2.8 V 3.0 V 3.2 V 3.3 V 3.8 V 4.0 V
1st Digit
C D E F
6
5
4
G H A L
4.75 V 5.0 V
2nd Digit 3rd Digit
Location Code
Pin 1 Ink Mark Identifier or Solid Pin 1 Dot or Dimple
XALYW
Wafer Lot Traceability Date Code
1
2
3
4th/5th Digits
YW
SOT-23L
ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA = -40C to +85C, Max TJ = 150C)
Characteristics Pin # Symbol Min Typ Max Unit
CONTROL ELECTRICAL CHARACTERISTICS
Input Voltage Range 1 1 1 VON/OFF ION/OFF 0 - - Vin - V ON/OFF Input Current (All versions) VON/OFF = 2.4 V
mA
V
2.5 - -
ON/OFF Input Voltages (All versions) Logic "0", i.e. OFF State Logic "1", i.e. ON State
VON/OFF
- 2.2
0.3 -
CURRENTS PARAMETERS
Current Consumption in OFF State (All versions) OFF Mode Current: Vin = Vout + 1.0 V, Iout = 0 mA
IQOFF IQON
mA mA mA
- - -
0.1
2.0
Current Consumption in ON State (All versions) ON Mode Sat Current: Vin = Vout + 1.0 V, Iout = 0 mA
170 900 210
200
Current Consumption in Saturation ON State (All versions) ON Mode Sat Current: Vin = Vout - 0.5 V, Iout = 0 mA Current Limit Vin = Vout + 1.0 V, (All versions) Output Short-circuited (Note 1)
IQSAT IMAX
1400 -
mA
175
Note 1. Iout (Output Current) is the measured current when the output voltage drops below 0.3 V with respect to Vout at Iout = 30 mA.
2
MOTOROLA DEVICE DATA
MC33263
ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA = -40C to +85C, Max TJ = 150C)
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Vin = Vout + 1.0 V, TA = 25C, 1.0 mA < Iout < 150 mA 2.8 Suffix 3.0 Suffix 3.2 Suffix 3.3 Suffix 3.8 Suffix 4.0 Suffix 4.75 Suffix 5.0 Suffix Vin = Vout + 1.0 V, -40C < TA < 80C, 1.0 mA < Iout < 150 mA 2.8 Suffix 3.0 Suffix 3.2 Suffix 3.3 Suffix 3.8 Suffix 4.0 Suffix 4.75 Suffix 5.0 Suffix 4 Vout V 2.74 2.94 3.13 3.23 3.72 3.92 4.66 4.90 2.8 3.0 3.2 3.3 3.8 4.0 4.75 5.0 2.86 3.06 3.27 3.37 3.88 4.08 4.85 5.1 4 Vout 2.7 2.9 3.09 3.18 3.67 3.86 4.58 4.83 2.8 3.0 3.2 3.3 3.8 4.0 4.75 5.0 2.9 3.1 3.31 3.42 3.93 4.14 4.92 5.17 V
Characteristics
Pin #
Symbol
Min
Typ
Max
Unit
LINE AND LOAD REGULATION, DROPOUT VOLTAGES
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Line Regulation (All versions) Vout + 1.0 V < Vin < 12 V, Iout = 60 mA Load Regulation (All versions) 4/6 1 Regline mV mV - - - - - - - 2.0 8.0 15 20 10 25 35 45 Vin = Vout + 1.0 V Iout = 1.0 to 60 mA Iout = 1.0 to 100 mA Iout = 1.0 to 150 mA Iout = 10 mA Iout = 100 mA Iout = 150 mA Regload Dropout Voltage (All versions) 4, 6 Vin - Vout mV 30 137 180 90 230 260
DYNAMIC PARAMETERS
Ripple Rejection (All versions) Vin = Vout + 1.0 V, Vpp = 1.0 V, f = 1.0 kHz, Iout = 60 mA Line Transient Response Vin = Vout + 1.0 V to Vout + 4.0 V, Iout = 60 mA, d(Vin)/dt = 15 mV/ms
4, 6 4, 6
dB
60 -
70
- -
mV
1.0
Output Noise Voltage (All versions) Cout = 1.0 F, Iout = 60 mA, f = 100 Hz to 100 kHz Cbypass = 10 nF Cbypass = 1.0 nF Cbypass = 0 nF Output Noise Density Cout = 1.0 F, Iout = 60 mA, f = 1.0 kHz
4, 6
VRMS
Vrms
- - - -
25 40 65
- - - -
4 4
VN tr
nV/ Hz
230
Output Rise Time (All versions) Cout = 1.0 F, Iout = 30 mA, VON/OFF = 0 to 2.4 V 1% of ON/OFF Signal to 99% of Nominal Output Voltage Without Bypass Capacitor With Cbypass = 10 nF
- -
40 1.1
- -
s ms
THERMAL SHUTDOWN
Thermal Shutdown (All versions)
-
150
-
C
MOTOROLA DEVICE DATA
3
MC33263
DEFINITIONS
Load Regulation - The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage - The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage - The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation - The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current - Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation - The change in input voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Line Transient Response - Typical over- and undershoot response when input voltage is excited with a given slope. Thermal Protection - Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically 150C, the regulator turns off. This feature is provided to prevent catastrophic failures from accidental overheating. Maximum Package Power Dissipation - The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 125C. The junction temperature is rising while the difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation, maximum load current or maximum input voltage (see Application Hints: Protection). The maximum power dissipation supported by the device is a lot increased when using appropriate application design. Mounting pad configuration on the PCB, the board material and also the ambient temperature are affected the rate of temperature rise. It means that when the IC has good thermal conductivity through PCB, the junction temperature will be "low" even if the power dissipation is great. The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150C for MC33263) and ambient temperature.
APPLICATION HINTS
Input Decoupling - As with any regulator, it is necessary to reduce the dynamic impedance of the supply rail that feeds the component. A 1 mF capacitor either ceramic or tantalum is recommended and should be connected close to the MC33263 package. Higher values will correspondingly improve the overall line transient response. Output Decoupling - Thanks to a novel concept, the MC33263 is a stable component and does not require any Equivalent Series Resistance (ESR) neither a minimum output current. Capacitors exhibiting ESRs ranging from a few mW up to 3W can thus safely be used. The minimum decoupling value is 1 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Noise Performances - Unlike other LDOs, the MC33263 is a true low-noise regulator. With a 10 nF bypass capacitor, it typically reaches the incredible level of 25 mVRMS overall noise between 100 Hz and 100 kHz. To give maximum insight on noise specifications, MOTOROLA includes spectral density graphics as well as noise dependency versus bypass capacitor. The bypass capacitor impacts the start-up phase of the MC33263 as depicted by the data-sheet curves. A typical 1 ms settling time is achieved with a 10 nF bypass capacitor. However, thanks to its low-noise architecture, the MC33263 can operate without bypass and thus offers a typical 20 ms start-up phase. In that case, the typical output noise stays lower than 65 mVRMS between 100 Hz - 100 kHz. 4 Protections - The MC33263 hosts several protections, conferring natural ruggedness and reliability to the products implementing the component. The output current is internally limited to a minimum of 175 mA while temperature shutdown occurs if the die heats up beyond 150C. These value lets you assess the maximum differential voltage the device can sustain at a given output current before its protections come into play. The maximum dissipation the package can handle is given by: P max
+ TJmax - TA R
qJA
If TJmax is internally limited to 150C, then the MC33263 can dissipate up to 595 mW @ 25C. The power dissipated by the MC33263 can be calculated from the following formula: Ptot or Vin max
+
V in
@ Ignd(Iout) ) Vin * Vout @ Iout
gnd out
out + PtotI ) V) I @ Iout
If a 150 mA output current is needed, the ground current is extracted from the data-sheet curves: 6.5 mA @ 150 mA. For a MC33263NW28R2 (2.8 V), the maximum input voltage will then be 6.48 V, a rather comfortable margin. MOTOROLA DEVICE DATA
MC33263
Typical Application - The following figure portraits the typical application for the MC33263 where both input/output decoupling capacitors appear. Figure 3. Copper Side Component Layout
Differential (Vin-Vout)
Figure 1. A Typical MC33263 Application with Recommended Capacitor Values
Input Output
Input 6 C3 1.0 mF 1 On/Off 5 4
C3 +
MC33263 + C1 C2
Output
MC33263
C2 1.0 mF 3 C1 10 nF
Rpull-up
2
ON/OFF
As for any low noise designs, particular care has to be taken when tackling Printed Circuit Board (PCB) layout. The figure below gives an example of a layout where stray inductances/capacitances are minimized.
This layout is the basis for an MC33263 performance evaluation board where the BNC connectors give the user an easy and quick evaluation mean.
Figure 2. Printed Circuit Board
MOTOROLA DEVICE DATA
5
MC33263
MC33263 Wake-up Improvement - In portable applications, an immediate response to an enable signal is vital. If noise is not of concern, the MC33263 without a bypass capacitor settles in nearly 20 ms and typically delivers 65 mVRMS between 100 Hz and 100 kHz. In ultra low-noise systems, the designer needs a 10 nF bypass capacitor to decrease the noise down to 25 mVRMS between 100 Hz and 100 kHz. With the adjunction of the 10 nF capacitor, the wake-up time expands up to 1 ms as shown on the data-sheet curves. If an immediate response is wanted, following figure's circuit gives a solution to charge the bypass capacitor with the enable signal without degrading the noise response of the MC33263. At power-on, C4 is discharged. When the control logic sends its wake-up signal by going to a high level, the PNP base is momentarily tight to ground. The PNP switch closes and immediately charges the bypass capacitor C1 toward its operating value. After a few ms, the PNP opens and becomes totally transparent to the regulator. This circuit improves the response time of the regulator which drops from 1 ms down to 30 ms. The value of C4 needs to be tweaked in order to avoid any bypass capacitor overload during the wake-up transient. Figure 4. A PNP Transistor Drives the Bypass Pin when Enable Goes High
Input Output
6 + C3 1.0 mF 1 On/Off R2 220 k
5
4 +
MC33263
C2 1.0 mF 3
2
C4 470 pF
MMBT2902LT1 Q1
C1 10 nF
Figure 5. MC33263 Wake-up Improvement with Small PNP Transistor
MC33263 Without Wake-up Improvement (Typical Response)
1 ms
MC33263 With Wake-up Improvement (Typical Response) 30 ms
6
MOTOROLA DEVICE DATA
MC33263
The PNP being wired upon the bypass pin, it shall not degrade the noise response of the MC33263. Figure 6 confirms the good behavior of the integrated circuit in this area which reaches a typical noise level of 26 mVRMS (100 Hz to 100 kHz) at Iout = 60 mA.
Figure 6. Noise Density of the MC33263 with a 10 nF Bypass Capacitor and a Wake-up Improvement Network
350 300 250 nV/sqrt (Hz) 200 Cbyp = 10 nF 150 100 50 0 100 1,000 10,000 Frequency (Hz) 100,000 1,000,000 Vin = 26 mVrms C = 10 nF @ 100 Hz - 100 kHz Vin = 3.8 V Vout = 2.8 V Co = 1.0 mF Iout = 60 mA Tamb = 25C
MOTOROLA DEVICE DATA
7
MC33263
TYPICAL PERFORMANCES CHARACTERISTICS
Ground Current Performances Figure 1. Ground Current versus Output Current
7.0 6.0 GROUND CURRENT (mA) 5.0 4.0 3.0 2.0 1.0 0 0 20 40 60 80 100 120 140 160 180 200 OUTPUT CURRENT (mA) Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Tamb = 25C 2.1 2.05 GROUND CURRENT (mA) 2.0 1.95 1.9 1.85 1.8 -40
Figure 2. Ground Current versus Ambient Temperature
Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA
-20
0
20
40
60
80
AMBIENT TEMPERATURE (C)
8
MOTOROLA DEVICE DATA
MC33263
TYPICAL PERFORMANCES CHARACTERISTICS
Line Transient Response and Output Voltage
Figure 3. Quiescent Current versus Temperature
200 QUIESCENT CURRENT ON MODE ( m A) 190 180 170 160 150 140 130 120 110 100 -40
Figure 4. Line Transient Response
Y1 Vin = 3.8 to 7.0 V Y1 = 1.0 mV/div Y2 = 1.0 V/div X = 1.0 ms Iout = 60 mA Tamb = 25C
dVin = 3.2 V
Y2
-20
0
20
40
60
80
100
TEMPERATURE (C)
Load Transient Response versus Load Current Slope Figure 5. Iout = 3.0 mA to 150 mA Figure 6. ISlope = 100 mA/ms (Large Scale) Iout = 3.0 mA to 150 mA
Y1 Y2 Vin = 3.8 V Y1 = 100 mV/div Y2 = 20 mV/div X = 200 ms/div Tamb = 25C
Y1
Vin = 3.8 V Y1 = 50 mA/div Y2 = 20 mV/div X = 20 ms Tamb = 25C
Y2
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 7. ISlope = 6.0 mA/ms (Large Scale) Iout = 3.0 mA to 150 mA
Y1
Figure 8. ISlope = 2.0 mA/ms (Large Scale) Iout = 3.0 mA to 150 mA
Y1
Vin = 3.8 V Y1 = 50 mA/div Y2 = 20 mV/div X = 100 ms Tamb = 25C
Y2
Vin = 3.8 V Y1 = 50 mA/div Y2 = 20 mV/div X = 200 ms Tamb = 25C
Y2
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
MOTOROLA DEVICE DATA
9
MC33263
TYPICAL PERFORMANCES CHARACTERISTICS
Noise Performances Figure 9. Noise Density versus Bypass Capacitor
350 300 250 nV/Hz 200 Cbyp = 10 nF 150 100 Vn = 65 mVrms @ C bypass = 0 Vn = 30 mVrms @ Cbypass = 3.3 nF 50 Vn = 25 mVrms @ C bypass = 10 nF over 100 Hz to 100 kHz 0 100 1000 10,000 FREQUENCY (Hz) 3.3 nF 0 nF Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 23C 70 60 RMS NOISE (mV) 50 40 30 20 10 0 100,000 1,000,000 0 Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 25C 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
Figure 10. RMS Noise versus Bypass Capacitor (100 Hz - 100 kHz)
BYPASS CAPACITOR (nF)
Settling Time Performances Figure 11. Output Voltage Settling Time versus Bypass Capacitor
1200 1000 SETTLING TIME ( m S) 800 600 400 200 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 BYPASS CAPACITOR (nF) 200 ms/div 500 mV/div Cbyp = 10 nF Vin = 3.8 V Vout = 2.8 V Cout = 1.0 mF Iout = 50 mA Tamb = 25C Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 25C
Figure 12. Output Voltage Settling Shape Cbypass = 10 nF
Figure 13. Output Voltage Settling Shape Cbypass = 3.3 nF
Figure 14. Output Voltage Settling Shape without Bypass Capacitor
100 ms/div 500 mV/div Cbyp = 3.3 nF
Vin = 3.8 V Vout = 2.8 V Cout = 1.0 mF Iout = 50 mA Tamb = 25C
10 ms/div 500 mV/div Cbyp = 0 nF
Vin = 3.8 V Vout = 2.8 V Cout = 1.0 mF Iout = 50 mA Tamb = 25C
10
MOTOROLA DEVICE DATA
MC33263
TYPICAL PERFORMANCES CHARACTERISTICS
Dropout Voltage Figure 15. Dropout Voltage versus Iout
250 200 DROPOUT (mV) 150 100 50 0 10 60 IO (mA) 100 150 85C 25C -40C DROPOUT (mV) 150 100 mA 100 50 0 -40 250 200 10 mA 60 mA
Figure 16. Dropout Voltage versus Temperature
150 mA
-20
0
20
40
60
80
100
TEMPERATURE (C)
Output Voltage Figure 17. Output Voltage versus Temperature
2.805 2.800 OUTPUT VOLTAGE (V) 2.795 60 mA 2.790 100 mA 2.785 2.780 2.775 2.770 -40 -20 0 20 40 60 80 100 150 mA 1 mA OUTPUT VOLTAGE (V) 2.860 2.840 2.820 2.800 25C 2.780 85C 2.760 2.740 0 20 40 60 80 100 120 140 160 TEMPERATURE (C) OUTPUT CURRENT (mA)
Figure 18. Output Voltage versus Iout
-40C
Ripple Rejection Performances Figure 19. Ripple Rejection versus Frequency with 10 nF Bypass Capacitor
0 -10 -20 -30 -40 (dB) -50 -60 -70 -80 -90 -100 100 1000 10,000 100,000 FREQUENCY (Hz) -80 -100 -120 10 100 1000 10,000 100,000 1,000,000 FREQUENCY (Hz) Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 25C (dB) 0 -20 -40 -60 Vin = 3.8 V Vout = 2.8 V CO = 1.0 mF Iout = 60 mA Tamb = 25C
Figure 20. Ripple Rejection versus Frequency without Bypass Capacitor
MOTOROLA DEVICE DATA
11
MC33263
OUTLINE DIMENSIONS
NW SUFFIX PLASTIC PACKAGE CASE 318J-01 (SOT-23L) ISSUE O
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.23 PER SIDE. 4. DIMENSIONS b AND b2 DO NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF THE b AND b2 DIMENSIONS AT MAXIMUM MATERIAL CONDITION. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSIONS D AND E1 ARE TO BE DETERMINED AT DATUM PLANE H. MILLIMETERS MIN MAX 1.25 1.40 0.00 0.10 0.35 0.50 0.35 0.45 0.10 0.25 0.10 0.20 3.20 3.60 3.00 3.60 2.00 2.40 0.95 1.90 0.55 0.25 0_ 10_
0.05 E
S PIN 1 INK MARK IDENTIFIER
0.2
M
CB
M
C B
1
A
2 3
5
A E1
b A1 A
0.1
4
M
CA
e
6
e1
D
S
A
B
(b)
q
H
c1 L
c
b1
D A A1 b b1 c c1 D E E1 e e1 L
SECTION A-A
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 Customer Focus Center: 1-800-521-6274 MfaxTM: RMFAX0@email.sps.mot.com - TOUCHTONE 1-602-244-6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, Motorola Fax Back System - US & Canada ONLY 1-800-774-1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 - http://sps.motorola.com/mfax/ HOME PAGE: http://motorola.com/sps/ JAPAN: Motorola Japan Ltd.; SPD, Strategic Planning Office, 141, 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan. 81-3-5487-8488
12
CCC EEE CCC EEE
q
MC33263/D MOTOROLA DEVICE DATA

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